Micron Breaks Ground on New Packaging and Testing Factory in China
Micron Technology, a leading global semiconductor company, recently announced the groundbreaking of its new packaging and testing factory in Xi'an. The project, with a total investment of 4.3 billion yuan, will further strengthen Micron's commitment to its operations, customers, and community in China.
The new factory is expected to begin operations in the second half of 2025, significantly enhancing the production capacity of Micron's Xi'an factory and injecting new vitality into the development of China's semiconductor industry. The factory will primarily produce mobile DRAM, NAND, and SSD products, and will introduce new production lines and advanced automation technologies to create a world-class smart factory.
Micron also announced the establishment of its first Center of Excellence (CoE) for packaging and test manufacturing sustainability in Xi'an, aiming to advance the company's partnerships in environmental, social, and governance (ESG) and achieve global sustainability goals.
The new factory project in Xi'an will also create 500 new jobs, increasing Micron's total workforce in China to over 4,800 employees.
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Date of record
27 March 2024
